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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A

Year : 1994 Volume number : 17 Issue: 04

A Cost-Benefit Analysis Model Of Product Design For Recyclability And Its Application (Article)
Subject: Recycling , Cost-Benefit , Dfe
Author: Rosy Chen      Fritz B. Prinz     
page:      502 - 507
Green Design An Introduction To Issues And Challenges (Article)
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page:      508 - 514
Waste Minimization In Electronic Component Processing A Systems Approach (Article)
Subject:
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page:      514 - 520
Hazardous Waste Minimization In Iii-V Wafer Fabrication Processes (Article)
Subject:
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page:      521 - 526
Thermal Conductivity Of Molding Compounds For Plastic Packagin (Article)
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page:      527 - 532
Fracture Properties Of Molding Compound Materials For Ic Plastic Packaging (Article)
Subject: Fracture Property
Author: John Suber      Trirat Hongsmatip     
page:      533 - 541